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2021-06-18T13:44:47+09:00
2021-06-18T13:44:47+09:00
2021-06-18T13:44:47+09:00
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Ritsumeikan Univ.KO-519
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14.25 0 0 14.25 127.245 788.25 Tm
(Fundamental study of ultraviolet-ray excited machining)Tj
/TT1 1 Tf
12 0 0 12 451.0059 759.75 Tm
(Yoshihiko CHIWAYA)Tj
-33.875 -2.313 Td
(When the light excitation substance such as a high polymer absorbs the l\
ight energy of an ultraviolet ray, it)Tj
-1 -1.5 Td
(will be excited. If its substance reacts with the processing material in\
an atomic order under the excited)Tj
0 -1.5 TD
(conditions, it may be available for fine processing. Thus, it seems that\
the processing in a sub-nanometer)Tj
T*
(order may be realized by the phenomenon that is called the luminescence.\
The following merits can be)Tj
T*
(considered; 1. Little reaction heat. 2. Little heat influence to a proce\
ssing material. 3. Easy and clean reaction)Tj
T*
(control in comparison with the chemical processing.)Tj
1 -2.5 Td
(In this research, the processing principle is verified by dipping the pr\
ocessing material for a fixed time in)Tj
-1 -1.5 Td
(pure water that is mixed the fluorescent substance glared by an ultravio\
let ray. The surface of copper that was)Tj
T*
(precisely lapped is used for an experiment. The abrasion of its surface \
is observed by AFM.)Tj
1 -2.5 Td
(This paper describes the processing characteristics of copper which ultr\
aviolet ray was exposed on. The)Tj
-1 -1.5 Td
(irradiation of ultraviolet ray increased the corrosion rate of copper, a\
nd the surface roughness becomes small.)Tj
T*
(The irradiation by ultraviolet ray improves the surface roughness over a\
ll condenses of processing liquid. The)Tj
T*
(minimum surface roughness was obtained at the appropriate irradiate time\
, pH, and the height or liquid level.)Tj
T*
(The temperature arise of liquid decreases the surface roughness of coppe\
r.)Tj
1 -2.5 Td
(Then the process of polishing the copper verified the processing princip\
le using a newly developed)Tj
-1 -1.5 Td
(ultraviolet polisher. This paper describes the abrasive characteristics \
of copper polished in a mixed liquid of)Tj
T*
(fluorescent substance and photocatalyst exposed to ultraviolet light. Ul\
traviolet irradiation increased the)Tj
T*
(corrosion rate of copper, and the surface roughness became small in the \
case of aluminum oxide. However,)Tj
T*
(the surface roughness became large in the case of titanium oxide, The fi\
ndings of this study indicated that the)Tj
T*
(photocatalyst titanium oxide has excessive action of oxidation for coppe\
r.)Tj
ET
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