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Ritsumeikan Univ.KO-366
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/TT0 1 Tf
14.25 0 0 14.25 94.2014 788.25 Tm
(Study on Fabrication of Micro Connector Using UV-LIGA Process)Tj
/TT1 1 Tf
12 0 0 12 485.6699 759.75 Tm
(Toshinori Unno)Tj
-36.764 -2.313 Td
(This thesis concerns the research development to aim at designing, the t\
est fabrication and the evaluation of)Tj
-1 -1.5 Td
(a micro connector with the narrowest pitches \(80 m\) in the world used \
for high-density packaging. The press)Tj
0 -1.5 TD
(fabrication or the injection molding has been used as the current produc\
tion methods of the connectors. These)Tj
T*
(methods however face the limitation that the minimum pitches are larger \
than 300 m. This research has)Tj
T*
(described that I have succeeded in the fabrication and the quality evalu\
ation of the micro connector that has)Tj
T*
(100 pins with 80 m of the minimum pitches by selecting various materials\
used for the substrate and the)Tj
T*
(fabrication process, and by optimizing the fabrication and processing co\
ndition. And also the definite)Tj
T*
(problems for the practical application have been made clear from the eva\
luation test result.)Tj
1 -2.5 Td
(This thesis consists of 8 Chapters as follows; \(1\) the recent market t\
rend that makes the pitches of the)Tj
-1 -1.5 Td
(connector narrower and the employment of UV-LIGA process that is promisi\
ng technology for the fabrication)Tj
T*
(of the micro structure which is corresponding to the current technology,\
\(2\) the standard process of UV-LIGA)Tj
T*
(and its characteristic, \(3\) the definition of the specificity of the m\
icro connector, the contact point design to)Tj
T*
(achieve the reliable contact and to be suitable for UV-LIGA process, \(4\
\) the selection of materials and the)Tj
T*
(design of the fabrication process employing the combination use of thick\
resist layer and UV-LIGA to get the)Tj
T*
(micro structure with high aspect ratio at the low price, \(5\) the expla\
nation of the important evaluation items)Tj
T*
(for the actualization of the connector and its evaluation results under \
the various conditions, \(6\) the result of)Tj
T*
(the high frequency simulation test has been described because of the use\
for the high frequency area, \(7\))Tj
T*
(several problems generated from the fabrication of the connector and the\
counter measures for these problems)Tj
T*
(and the subjects for the further study, \(8\) summary of all results fro\
m this research.)Tj
1 -2.5 Td
(In this research I have established the micro connector fabrication proc\
ess which uses UV-LIGA process,)Tj
-1 -1.5 Td
(and have made clear the definite problems for the practical uses in IT m\
arket. I am sure that the fruits from)Tj
T*
(this research will contribute to the actualization of high-density packa\
ging of connectors in future.)Tj
ET
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